MARTIN VD90.5106 solder Lead-free 42 g

The VD90.5106 is a lead-free Solder Sphere optimal to use for reballing of BGA and CSP chips. It's material composition equals standard alloys in electric manufacturing (lead free: Sn96,5Ag3Cu0,5). Hence, processes parameter for i.e. reflow can be used for reballed SMDs in same manner as for new ones. As a result of a special and unique manufacturing procedures, solder spheres have best surface quality and repeatable sphere shape. Both are important parameter for easy usage with stencils and stable reballing processes.