Zestron FA + 25 l
Solvent-based cleaning agent designed to remove all types of flux residues from electronic assemblies, ceramic hybrids, power electronics (power modules, leadframe-based discretes, power LEDs) and packages (Flip Chips/CMOS). The cleaner is suitable for use in dip tank (Ultrasonic and Spray-under-immersion) and centrifugal cleaning machines.
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- High cleaning performance and very long bath life:
The product is characterized by its high cleaning performance and bath loading capability ensuring an extremely long bath life. - No specific explosion-proof environment:
The cleaning medium does not require any specific explosion-proof environment. - Good rinsability:
Due to the surfactant-free formulation, the product can be easily rinsed. - Optimal preparation for subsequent processes:
For Flip Chips/CMOS, the cleaning agent reduces the void rate during underfill and improves the image resolution by removing all tacky fluxes. It creates optimal surface properties for subsequent wire bonding/molding processes, especially for power modules, leadframe-based discrete components and Power LEDs. - Cleaning agent regeneration:
During the use of ZESTRON® FA+, the ZESTRON® adsorber HM1 can remove heavy metals from the cleaning bath.
- High cleaning performance and very long bath life:
Specifications
Brand | Zestron |
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EAN | - |
Part number | 5630-0025 |
Weight 1 | 25 |