Flux 2.5 l for dip tinning HAlogen fro and No-clean Flush

The halogen-free activated no-clean flux 500-17/1 has a relatively high dry matter content. This makes the flux very suitable for use in e.g. a dip soldering process. B. tinning of enamelled copper wires.

The flux 500-17/1 has been specially developed for the dip soldering process. Due to its high solids content, it is ideal for tinning enamelled copper wires. The flux and solids also resist the higher temperatures required to burn off the paint. The solids still present after immersion are sufficient to ensure good wetting.